苹果手机iPhone折叠屏台积电芯片与SG2016CAN爱普生晶振X1G004801005600
苹果手机iPhone折叠屏台积电芯片与SG2016CAN爱普生晶振X1G004801005600
目前市场调研机构数据,近年来台积电来自苹果手机的收入比重逐渐提高.在台积电的前十大客户中,苹果手机占据其中收入的比重也从2016年的25%提高到2022年的37%.爱普生晶振可以看到苹果在2021年贡献给台积电148亿美元的营收,其他所有客户贡献的营收也不过420亿美元,毕竟苹果iPhone/iPad的A系列及M1/M2系列芯片都是台积电代工,而且都是最先进的7nm、5nm工艺,价格高,产量大,营收占比自然就高出其他厂商.
时间倒回到2019年,华为当年是台积电第二大客户,当时苹果营收占比23%左右,华为占比达到了14%,如果没有美国的限制,日产晶振华为近年来也会有大量自研芯片交由台积电代工,可惜麒麟9000之后芯片已经绝版.
SG2016CAN爱普生晶振X1G004801005600,苹果手机iPhone折叠屏晶振
爱普生有源晶振编码
型号
频率
长X宽X高
输出波
电源电压
工作温度
频差
最大值
X1G004801004600
SG2016CAN
8.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-40 to 105 °C
+/-50 ppm
≤ 1.8 mA
X1G004801004900
SG2016CAN
4.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-40 to 105 °C
+/-50 ppm
≤ 1.8 mA
X1G004801005000
SG2016CAN
12.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-20 to 70 °C
+/-25 ppm
≤ 1.8 mA
X1G004801005100
SG2016CAN
12.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-40 to 105 °C
+/-50 ppm
≤ 1.8 mA
X1G004801005200
SG2016CAN
12.288000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-20 to 70 °C
+/-25 ppm
≤ 1.8 mA
X1G004801005300
SG2016CAN
12.288000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-40 to 105 °C
+/-50 ppm
≤ 1.8 mA
X1G004801005400
SG2016CAN
14.745600 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-40 to 85 °C
+/-50 ppm
≤ 1.8 mA
X1G004801005500
SG2016CAN
14.745600 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-40 to 105 °C
+/-50 ppm
≤ 1.8 mA
X1G004801005600
SG2016CAN
16.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-40 to 105 °C
+/-50 ppm
≤ 1.8 mA
X1G004801005700
SG2016CAN
20.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-20 to 70 °C
+/-25 ppm
≤ 1.8 mA
X1G004801005800
SG2016CAN
20.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-40 to 85 °C
+/-50 ppm
≤ 1.8 mA
X1G004801005900
SG2016CAN
24.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-20 to 70 °C
+/-25 ppm
≤ 2.2 mA
X1G004801006000
SG2016CAN
24.576000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-40 to 85 °C
+/-50 ppm
≤ 2.2 mA
X1G004801006100
SG2016CAN
27.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-40 to 85 °C
+/-50 ppm
≤ 2.2 mA
X1G004801006200
SG2016CAN
32.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-40 to 85 °C
+/-50 ppm
≤ 2.2 mA
X1G004801006300
SG2016CAN
32.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-40 to 105 °C
+/-50 ppm
≤ 2.2 mA
X1G004801006400
SG2016CAN
33.330000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-40 to 85 °C
+/-50 ppm
≤ 2.2 mA
X1G004801006500
SG2016CAN
33.330000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-40 to 105 °C
+/-50 ppm
≤ 2.2 mA
X1G004801006600
SG2016CAN
33.333300 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-40 to 105 °C
+/-50 ppm
≤ 2.2 mA
X1G004801006700
SG2016CAN
40.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-40 to 85 °C
+/-50 ppm
≤ 2.2 mA
X1G004801006800
SG2016CAN
48.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-20 to 70 °C
+/-25 ppm
≤ 2.6 mA
X1G004801006900
SG2016CAN
48.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-40 to 105 °C
+/-50 ppm
≤ 2.6 mA
X1G004801007000
SG2016CAN
50.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-20 to 70 °C
+/-25 ppm
≤ 2.6 mA
X1G004801007100
SG2016CAN
72.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.710 to 3.630 V
-20 to 70 °C
+/-25 ppm
≤ 3.0 mA
X1G004801007200
SG2016CAN
72.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.710 to 3.630 V
-40 to 85 °C
+/-50 ppm
≤ 3.0 mA
X1G004801007300
SG2016CAN
72.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
2.250 to 3.630 V
-40 to 105 °C
+/-50 ppm
≤ 3.0 mA
X1G004801007600
SG2016CAN
32.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-20 to 70 °C
+/-25 ppm
≤ 2.2 mA
X1G004801007700
SG2016CAN
26.000000 MHz
2.00 x 1.60 x 0.70 mm
CMOS
1.600 to 3.630 V
-20 to 70 °C
+/-25 ppm
≤ 2.2 mA
在这以后台积电对苹果的依赖不断提升,考虑到2022年下半年芯片市场由紧缺转向过剩,很多客户会砍单,而苹果受手机、PC销量下滑的影响较小,预计在台积电的营收占比可能会进一步提升.
2022年苹果占据台积电收入的比重达37%台积电是全球最大也是工艺最先进的晶圆代工厂,日本进口晶振无晶圆芯片设计公司几乎都要依赖台积电代工,包括苹果、AMD、高通、联发科、NVIDIA等等,其中苹果当之无愧地成为台积电第一大客户,而且依赖程度越来越高,2021年近4成收入都来自苹果手机.
SG2016CAN爱普生晶振X1G004801005600,苹果手机iPhone折叠屏晶振
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